PRECONFERENCE SEMINARRFID In Packaging
RFID Journal LIVE! 2007 features eight preconference seminars providing in-depth information on specific aspects of RFID. Attendees can choose to participate in one of these prior to the opening of the main conference program. Preconference seminars are available through the Conference + Preconference Pass or the Preconference Seminar + Exhibit-Only Pass.
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| 12:00 pm |
RFID Basics
This session is designed for all precoference seminar attendees who want to gain the foundational knowledge of RFID needed to engage vendors and begin to develop a business case. The differences between the various classes of tags will be explained, including active and passive systems. The need for additional IT systems to build upon RFID in real-world applications will be highlighted. The session also includes a very brief overview of the EPCglobal Network, the future of ISO standards, ETSI reader regulations and the latest standardization efforts worldwide. Finally, the relationship between different standards in the area of RFID and EPC, including the latest EPC generation 2 standard, will be presented.
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| 12:45 pm |
Break |
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| 1:15 pm |
Overcoming Symmetry Challenges in RFID Packaging
Most products have symmetry to them and are inherently uniform for not only aesthetic features but also for basic mechanical integrity, manufacturability and cost of the packaging. But adding singular features or foreign devices can induce asymmetry and present enormous challenges to packaging design. Ignoring the example of how a flat inlay label RFID impacts a shipping carton, the majority of applications of RFID are not trivial and generally pose a challenge to existing design rules.
Speaker:
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Robb Clarke, Ph.D.,
School of Packaging,
Michigan State University |
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Dr. Pat King, Leader, Global Electronics Strategies, Michelin |
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| 2:00 pm |
Conductive Ink for RFID-Enabled Packaging Production Today
Parelec, a conductive ink and adhesive manufacturer has developed an efficient and cost-effective method for RFID-Enabled packaging by printing an antenna directly onto a paperboard layer with conductive ink and an attached RFID inlay. Hear how this process can minimize the impact for manufacturers and their production process.
Speaker:
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Geva Barash, CEO, President, Parelec |
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| 2:45 pm |
Refreshment Break |
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| 3:15 pm |
The Challenges and Opportunities of Implementing RFID in Packaging
RFID is likely to impact all areas of the packaging industry. In this session, hear from the Senior Package Development Engineer of Purdue Pharma explain what some of the current issues are, what work is currently going on and what challenges are facing the industry.
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Harry Ramsey, Senior Package Development Engineer, Purdue Pharma |
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| 3:55 pm |
RFID: The Package is the Tag
The idea of an RFID label soon may be out of date, as manufacturers want to reduce their costs by integrating the RFID tag into their packaging. This represents an opportunity and a challenge. Hear how one packaging company overcame the challenges and seized the opportunity with their new adaptive-kernel approach.
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Doug Lilac, Technical Director for Innovation, Pliant Corp. |
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| 4:35 pm |
Smart Packaging: Adding Value
In some specialty applications, RFID can be used in product packaging to provide extra value for customers. Hear how one company is integrating RFIDinto smart packaging with its partners.
Speaker:
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| 5:15 pm |
Preconference Seminar Concludes |
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See Complete Agenda » |
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RFID Journal LIVE! Has All the Content to Meet Your Needs |
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RFID Journal LIVE! 2007 is produced by RFID Journal, the World's RFID Authority.
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