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PRECONFERENCE SEMINAR
RFID in Packaging and Labeling This one-day preconference seminar is designed specifically for label converters, packagers, printing companies and others looking to understand the market opportunity for selling RFID labels, and how they can enter the market. The seminar will cover everything from market analysis to the actual manufacturing process. This is a unique opportunity to hear from the experts about inks for printing antennas, chip attachment options, label insertion, quality control and much more.
RFID Journal LIVE! preconference seminars provide in-depth information on specific aspects of EPC and RFID technologies. Attendees can choose to participate in one of these sessions prior to the opening of the main conference program. Preconference seminars are available through either the Full Conference Pass or Preconference + Exhibit-Only Pass.
April 16, 200810:00 am | General Session: RFID Basics
New to RFID? This optional session is open to all preconference seminar attendees who want to gain a basic understanding of the fundamentals of RFID. The differences between the various classes of tags will be explained, including active and passive systems, and the need for additional IT systems to build upon RFID in real-world applications will be highlighted. The session will also include a very brief overview of the EPCglobal Network, the future of ISO standards, ETSI reader regulations and the latest standardization efforts worldwide. Finally, the relationship between different standards in the area of RFID and EPC, including the latest EPC Gen 2 standard, will be presented. Speaker:
Mark Roberti, Founder and Editor, RFID Journal LLC
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10:45 am | Movement from Room to Room
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11:00 am | RFID in Packaging-The Pros and Cons of Embedding Tags
This session will feature a presentation of test findings and results of utilizing radio frequency identification in a packaging environment, including embedding and attachment options. It will also offer a discussion of best approaches for source tagging in such a setting, from both a functional and cost perspective. Speaker:
Jeanne McCann, Senior Project Manager, RFID & Printed Electronics, Weyerhaeuser
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11:45 am | Moving to RFID-Enabled Packaging
Kimberly-Clark has been working with its packaging suppliers to embed UHF RFID transponders inside corrugated packaging for cases of products. Hear what the company and its partners learned, best practices for moving from EPC labels to embedded EPC transponders, and what packaging suppliers can do to help their customers make the transition. Speaker:
John Onderko, Senior RFID Packaging Engineer, Kimberly-Clark
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1:15 pm | Selecting the Right Option for RFID Tagging
There are a wide variety of business reasons for tagging pallets, cases, items and assets—from retail compliance to end-to-end management of product manufacturing and delivery. And the options for deploying RFID—from subcontracting to service bureaus, to complete enterprise integration—are equally diverse. This presentation will provide an overview of RFID tagging options available from label converters, explaining how they relate to different business cases for using RFID. A well-known consumer products company will describe the execution options they piloted, and the rationale for the tagging option it currently uses. Speakers:
David Uland, Senior Business Development Manager, WS Packaging
Brian Zeigler, Packaging Engineer, The Hershey Company
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1:45 pm | The Size of the RFID Market for Packaging and Label Converters
The opportunities for RFID in the packaging and labeling sector vary greatly depending on the angle one would want to enter the market from. In this session, hear about the latest market analysis in the industry, where unique opportunities lie and what potential customers really want. Speaker:
Andrew Nathanson, Practice Director, AIDC/RFID Technologies & Retail Automation, Venture Development Corp.
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2:30 pm | Putting RFID Inside the Box
Integrating RFID transponders into packaging has been a challenge, but Domino Integrated Solutions Group offers an innovative technology called HIDE-Pack, designed to eliminate the need for a paper label by incorporating an RFID inlay within the packaging medium. A sustainable approach to RFID-enabled packaging, the HIDE-Pack solution consists of embedding an RFID inlay within the structure of a package, so that the inlay is not visible from either outside or inside the package. Thus, the inlay effectively becomes an integral part of the packaging medium. Learn how packaging companies can use this technology to RFID-enable their packaging. Speakers:
Paul de Blois, Vice President and General Manager, HIDE-Pack
B. Dwain Farley, CEO, Domino Integrated Solutions Group
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3:30 pm | Enhancing Smart Labels and Packaging
Technology providers are constantly improving their chip, antenna and inlay manufacturing processes to improve the performance of transponders embedded in lables and packaging, and to make the processes of creating and embedding labels more economical. In this session, hear from three leading RFID chip and inlay providers about their recent product enhancements, and learn how you and your customers can benefit from these offerings. Moderator:
Andrew Nathanson, Practice Director, AIDC/RFID Technologies & Retail Automation, Venture Development Corp.
Panelists:
DJ Lee, Marketing Manager, Avery Dennison RFID
Tim Newsom, Manager, Worldwide Marketing Retail & Supply Chain, NXP Semiconductors
Jan Svoboda, Sales & Marketing Director, UPM Raflatac
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RFID Journal LIVE! 2008 is produced by RFID Journal, the World's RFID Authority.
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Who Should Attend