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PRECONFERENCE SEMINAR

RFID in Packaging and Labeling

This one-day preconference seminar is designed specifically for label converters, packagers, printing companies and others looking to understand the market opportunity for selling RFID labels, and how they can enter the market. The seminar will cover everything from market analysis to the actual manufacturing process. This is a unique opportunity to hear from the experts about inks for printing antennas, chip attachment options, label insertion, quality control and much more.

RFID Journal LIVE! preconference seminars provide in-depth information on specific aspects of EPC and RFID technologies. Attendees can choose to participate in one of these sessions prior to the opening of the main conference program. Preconference seminars are available through All Access, Conference + Preconference or Preconference + Exhibit-Only Pass.




What You Will Learn From This Track:
• A market potential overview of RFID, with future projections for growth
• Expectations and predictions, including emerging markets and innovations
• How to evaluate various options for RFID-enabling customers' packaging
• Cost-effective ways of RFID-enabling packaging
• Understanding the production value chain for labels and entry points
• Making the best packaging choices for products
• The impact of package forms on RFID readability and operation
• Why asymmetrical packaging may result in air gaps that can be exploited for tagging

April 27, 2009

10:30 am

RFID Basics
New to RFID? Here's your opportunity to gain a basic introduction to the fundamentals of RFID. The differences between the various classes of tags will be explained, including active and passive systems. The need for additional IT systems to build upon RFID in real-world applications will be highlighted. The session also includes a very brief overview of the EPCglobal Network, the future of ISO standards, ETSI reader regulations and the latest standardization efforts worldwide. Finally, the relationship between different standards in the area of RFID and EPC, including the latest EPC generation 2 standard, will be presented.

11:30 am

The Size of the RFID Market for Packaging and Label Converters
The opportunities for RFID in the packaging and labeling sector vary greatly depending on the angle from which one enters the market. In this session, hear about the latest market analysis in the industry, where unique opportunities lie and what potential customers really want.

Speaker:
Andrew Nathanson, Manager, Market Research & Planning , Zebra Technologies
Takeaways:
• A market potential overview of RFID, with future projections for growth
• Expectations and predictions, including emerging markets and innovations

12:15 pm

Overcoming Symmetry Challenges in RFID Packaging
Most products have symmetry and are inherently uniform, not only for aesthetic features but also for basic mechanical integrity, manufacturability and packaging costs. But adding singular features or foreign devices can induce asymmetry and present enormous challenges to packaging design. Putting aside the example of how a flat inlay label RFID impacts a shipping carton, the majority of RFID applications are not trivial, and generally pose a challenge to existing design rules. Learn how RFID can impact packaging production, and how to overcome such obstacles.

Speaker:
Robb Clarke, Ph.D., Michigan State University
Takeaways:
• The impact of package forms on RFID readability and operation
• Why asymmetrical packaging may result in air gaps that can be exploited for tagging

1:00 pm

Lunch

1:45 pm

RFID-Enabled Packaging Products
As more companies look to tag cases of products and high-value individual items, the packaging industry will be asked to RFID-enable its packaging. Yet, some packaging companies don't know where to begin, or how to help customers move forward. In this session, learn how to embed RFID tags into corrugate, and in the packaging of items, as well as the challenges involved—and how to overcome them.

Speaker:
Bill English, Principal, Packaging Consultants
Takeaways:
• How to evaluate various options for RFID-enabling customers' packaging
• Cost-effective ways of RFID-enabling packaging

2:30 pm

Using RFID on or Around Metal-Not a Problem Anymore
Historically, the adoption of passive RFID has been hindered by the technology's inability to perform on or near metals, but this is no longer the case. Recent material innovations and augmentations to existing products, such as EPC Gen 2 tags, now enable RFID to function in these environments without sacrificing performance and reinventing the wheel. Learn about these solutions and their implementations from a panel of experts who will cover the issue from every angle.

Moderator:
Andrew Nathanson, Manager, Market Research & Planning , Zebra Technologies
Panelists:
John Bartos, Senior Product Manager, Intermec Technologies
Andre Coté , SVP Business Development, Omni-ID
Bret Kinsella, COO, ODIN
Joseph Leone, Sr. Director, Logistics Automation Solutions, SAIC
Michael Plante, Vice President Sales and Marketing, Emerson & Cuming Microwave Products

3:15 pm

Break

3:30 pm

The RFID Label- and Package-Making Process
This session will explain the step-by-step process for manufacturing RFID labels from scratch, and for purchasing RFID inlays and converting them into RFID labels and smart packaging. The pros and cons of each approach will be explained, including costs and manufacturing challenges.

Speaker:
Max Golter, Vice President, Sales, bielomatik jagenberg Inc.
Takeaways:
• Understanding the production value chain for labels and entry points
• Making the best packaging choices for products


RFID Journal LIVE! 2009 is produced by RFID Journal, the World's RFID Authority.

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