Senior Package Development Engineer,
Purdue Pharma L.P.
Harry Ramsey is the senior package evelopment Engineer for Purdue Pharma L.P., where he has worked for eight years. He is a graduate of the Michigan State University School of Packaging, and has been an alternate member of the IoPP Drug & Pharmaceutical Packaging Committee since 1997. Ramsey was a member of the project team at Purdue Pharma L.P. that designed and launched the first fully-integrated EPC tagged product at the unit-level. The system went live in November 2004 and utilized UHF technology exclusively. Ramsey currently is a member of the EPCglobal HLS BAG Technology Working Group.